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PC Heatsinks and CPU Cooling
Processors and other high-power chips generate heat as they work, and if that heat is not removed they can become unstable or be damaged. A heatsink is a passive cooling device that draws heat away from a chip and spreads it over a large surface area, where it can be carried off by the surrounding air. Heatsinks are made from metals with good thermal conductivity, typically aluminium or copper, and are pressed against the chip with a thin layer of thermal paste to fill tiny gaps and improve heat transfer.
The shape of a heatsink is designed to expose as much surface as possible to moving air. Extruded heatsinks are made by forcing aluminium through a die to form a continuous profile of fins, which is an economical way to produce many parallel fins. Folded-fin heatsinks instead attach a thin, repeatedly folded sheet of metal to a base, allowing very closely spaced fins and a large surface area in a compact form. A fan is often added to force air across the fins, greatly increasing the rate at which heat is removed.
Some systems use thermoelectric cooling, based on the Peltier effect, in which passing an electric current through a junction of two materials makes one side cold and the other hot. A Peltier cooler can pull heat away from a chip and pump it to a heatsink, allowing temperatures below those a heatsink alone could reach. However, these devices consume significant power and produce extra heat that must itself be removed, so they are used selectively rather than in typical machines.
Frequently asked questions
- What does a heatsink do?
- It draws heat away from a chip and spreads it over a large finned surface, where the surrounding air can carry the heat away.
- What is the difference between extruded and folded-fin heatsinks?
- Extruded heatsinks are formed by pushing metal through a die to make fins, while folded-fin types use a folded metal sheet to pack fins more closely.
- How does a Peltier cooler work?
- It uses an electric current through a junction of two materials to make one side cold, pumping heat away from a chip, though it consumes power and generates extra heat.
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PC heatsinks and CPU coolers
related topics: Heatsinks and cooling,
Thermoelectric cooling |
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AMD PROCESSOR Thermal Considerations pdf file |
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Computer cooling
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CPU heatsinks, fans,
and fan noise |
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Heat
Pipe Cooling Systems In The Electronics Industry Use Of Heat Pipe Cooling
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Heat pipes |
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Heat pipes
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Heatsink guide
provides in-depth information about CPU cooling. Includes cooler tests, recommendations, graphics card cooling info, info about peltier
coolers, heatsink guide, heatsinks, coolers, thermal resistance, overclocking,
heat, cpu, peltier element, peltier cooler, thermal compound, heat sink,
cooling, hard drive, graphics card, athlon, pentium, Learn about fan
performance, noise, and bearing types |
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Heatsinks
and cooling devices Nature Convection Heat Sinks, Forced Convection Heat
Sinks, Heat Pump Application Note, ThermoElectric Cooler (TEC), ThermoElectric
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Heat
Sink Selection Heat Sink Selection, How to select a heatsink,
ppt file |
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Intel® Pentium® 4 Processors Thermal management intel PROCESSOR Thermal
Considerations |
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Micro ATX Thermal Design Suggestions pdf file |
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Peltier
guide a peltier cooler is a cooler that uses a peltier element (TEC).
Peltier coolers consist of the peltier element itself, and a powerful
heatsink/fan combination to cool the TEC |
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Pentium
PROCESSOR THERMAL DESIGN GUIDELINES The goal of this document is to provide
thermal performance information for the Pentium processor and recommendations
for meeting the thermal requirements imposed on systems. This application note
attempts to provide an understanding of the thermal characteristics of the
Pentium processor and some examples of how the thermal requirements can be met, pdf file |
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Processor coolers
Chipset Heatsink, processor coolers, Extruded heatsinks, Folded fin heatsinks,
Fans |
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Roundup of coolers
for Pentium IV |
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Technical notes about fans Air Flow - Static Pressure Characteristics, pdf file |
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Temperature
measurement in the Intel® CoreTM Duo Processor |
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Thermal
management solutions and heat sinks Power Heat Sinks, Heat Pipe Integrated
Heat Sinks, Heat Pipes, Folded Fin Heat Sinks, Stacked Fin Heat Sinks, Bonded
Fin Heat Sinks, TEC Integrated Heatsinks, Extruded Heatsinks, Cold Forged
Heatsinks, Natural Convection Heat Sinks, Slim Heat Sinks, Mini Modular Heat
Sinks, Cold Plates |
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Thermoelectric Modules Thermoelectric Solutions for Precision Thermal
Management, Thermo Electric Cooling |
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Thermal paste review
Thermal paste |
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Use of fans pdf |
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Last updated on:
2026-06-24
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